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Heat Sinks

 

High Power Bonded Heat Sinks

  • High Thermal Performance

  • Pure Aluminum Fins bonded into an extruded Base

  • Bonded or Pressed Fin Construction

  • High Density

  • High (30:1) Ratio

 

High Power Soldered Heat Sinks

  • Extremely High Power

  • Small Volume

  • Copper Baseplate/Fins

  • High Thermal Conductivity (2x Aluminum)

  • High Efficiency

 


Hockey Puck Cooler

  • Specifically Designed for stacked or individual Disc Shaped Semiconductors

  • Cold Welded Fin/Baseplate Attachment

  • Lowest Thermal Interface Resistance

 
 
Manufacturers:

 
 
 
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Copyright 1999 DALI Technical Sales. All rights reserved.
Revised: November 07, 2009