High Power Bonded Heat Sinks

• High Thermal Performance

• Pure Aluminum Fins bonded into an extruded Base

• Bonded or Pressed Fin Construction

• High Density

• High (30:1) Ratio

 

High Power Soldered Heat Sinks

• Extremely High Power

• Small Volume

• Copper Baseplate/Fins

• High Thermal Conductivity (2x Aluminum)

• High Efficiency

 

Hockey Puck Cooler

• Specifically Designed for stacked or individual Disc Shaped Semiconductors

• Cold Welded Fin/Baseplate Attachment

• Lowest Thermal Interface Resistance